CP618 COPPER END FEED BENT TAP CONNECTOR (A'I PALAPALA)
Hōʻike
● Material: keleawe kūlana kiʻekiʻe
● E like me ka BS EN 1254-1: 1998 maʻamau no nā mea hao keleawe
Ka helu hana
● ʻO ke kaomi kiʻekiʻe loa: 25bar (PN25) a hiki i 30°C
● Ka wela wela o ka hana: 0°C – 110°C
Palapala hōʻoia
● Apono ʻia ʻo WRAS
Palapala noi
● He kūpono no ka wai wela a me ke anuanu e like me ka hoʻomehana, ka wai anuanu a me ke kinoea
Ke Ana Hoʻohālike & Hoʻolālā
| Hoʻohālike | Hōʻike (mm) | D1 | D2 | L1 | A | B |
| CP618B1212 | 12×1/2" | 12 | 1/2" | 8.6 | 25.5 | 23.5 |
| CP618B1412 | 14×1/2" | 14 | 1/2" | 10.6 | 31 | 27 |
| CP618B1512 | 15×1/2" | 15 | 1/2" | 10.6 | 28.5 | 26 |
| CP618B1612 | 16×1/2" | 16 | 1/2" | 10.6 | 31.5 | 25.5 |
| CP618B1534 | 15×3/4" | 15 | 3/4" | 10.6 | 39.5 | 35 |
| CP618B1634 | 16×3/4" | 16 | 3/4" | 10.6 | 39.5 | 35 |
| CP618B1834 | 18×3/4" | 18 | 3/4" | 12.6 | 38.5 | 34.5 |
| CP618B2234 | 22×3/4" | 22 | 3/4" | 15.4 | 41.5 | 35.5 |
Nā hiʻohiʻona huahana
Ua ʻae ʻia nā mea hoʻopili keleawe solder apo WRAS.
ʻO kā mākou mau mea hoʻopili apo solder a pau me ka solder-free solder i ISO 9453 i hoʻokomo ʻia i loko o lākou.
He wikiwiki a maʻalahi hoʻi ka hoʻokomo ʻana i nā mea hoʻopili apo solder, e wela wale i nā wēlau me ka ipu ahi, e heheʻe ka solder i hoʻopili ʻia e hana i kahi hui paʻa wai. He kūpono kēia mau paipu keleawe no ka wai inu (inu) a me ka hoʻomehana a me ka wai anuanu i hui pū me BS EN 1057 paipu keleawe a me ka paipu.
Hōʻike huahana
1. E hoʻohana i ke keleawe kūlana kiʻekiʻe, ʻaʻohe pōʻino i ke kino, kū i ka corrosion.
2. 16 bar kaomi i helu ʻia a hiki i 30°C me ka pae wela hana o 0°C – 110°C.
3. Hoʻopili ʻia i loko o ka ʻeke i loko. Hiki ke hoʻohana ʻia ka lepili no ka mākeke kūʻai.
Ko makou Pono
1. Ua hōʻiliʻili mākou i ka ʻike waiwai ma o ka launa pū ʻana me nā mea kūʻai aku o nā koi like ʻole ma mua o 20 mau makahiki.
2. Inā loaʻa kekahi koi, hiki i kā mākou ʻinikua kuleana huahana ke nānā aku e hoʻopau i ka pilikia.
FAQ
1. Hiki iaʻu ke hāʻawi i kahi hōʻailona kauoha?
A: ʻAe, hoʻokipa mākou i ke kauoha laʻana e hoʻāʻo a nānā i ka maikaʻi.
2. Aia kekahi palena MOQ no kā mākou kauoha?
A: ʻAe, ʻo ka hapa nui o nā mea he palena MOQ. ʻAe mākou i ka liʻiliʻi liʻiliʻi i ka hoʻomaka ʻana o kā mākou hui ʻana i hiki iā ʻoe ke nānā i kā mākou huahana.
3. Pehea e hoʻouna ai i nā ukana a pehea ka lōʻihi o ka lawe ʻana i nā waiwai?
A. ʻO ka mea maʻamau i hoʻouna ʻia ma ke kai. Ma ka laulā, ʻo ka manawa alakaʻi he 25 mau lā a 35 mau lā.
4. Pehea e hoʻomalu ai i ka maikaʻi a he aha ka hōʻoia?
A. Kūʻai mākou i nā waiwai mai nā mea hana hilinaʻi wale nō, ke hana nei nā mea āpau i ka nānā ʻana i ka maikaʻi piha i kēlā me kēia kaʻina hana. Hoʻouna mākou i kā mākou QC e nānā pono i nā waiwai a hoʻopuka i ka hōʻike i ka mea kūʻai aku ma mua o ka hoʻouna ʻana.
Hoʻonohonoho mākou i ka hoʻouna ʻana ma hope o ka hala ʻana o nā waiwai i kā mākou nānā.
Hāʻawi mākou i kekahi manawa palapala hōʻoia i kā mākou huahana e like me ia.
5. Pehea e hana ai me ka huahana kūpono ʻole?
A. Inā hewa kekahi manawa, e nānā mua ʻia ka laʻana hoʻouna a i ʻole ka waihona.
A i ʻole e hoʻāʻo mākou i ka laʻana huahana unqualified e ʻike i ke kumu kumu. E hoʻopuka i ka hōʻike 4D a hāʻawi i ka hopena hope.
6. Hiki iāʻoe ke hana e like me kā mākou hoʻolālā a hōʻailona paha?
A. ʻOiaʻiʻo, loaʻa iā mākou kā mākou hui R&D ʻoihana ponoʻī e hahai i kāu koi. Hoʻokipa ʻia ʻo OEM a me ODM.
